Multiple modules with the same or different specifications can be easily cascaded to increase the number of channels. Currently, four different versions of CION modules are available.

The CION modules are based on the CION™ interface chip, also developed by GOEPEL Electronics, and can be serially accessed and controlled via TAP. It is an external boundary-scan extension of the unit under test and can be used to test peripheral I/Os, connectors, backplanes, bases etc.

Multiple modules of the same or different specifications can be easily cascaded to increase the number of channels. Currently, we offer four different versions of the CION module.

The CION modules are based on the CION™ interface chip, also developed by GOEPEL Electronics, and can be accessed and controlled serially via the TAP. It is an external boundary-scan extension of the unit under test and can be used to test peripheral I/Os, connectors, backplanes, bases etc.

Multiple modules of the same or different specifications can be easily cascaded to increase the number of channels. Currently, we offer four different versions of the CION module, which is based on the CION™ interface chip, also developed by GOEPEL Electronics, and can be accessed and controlled serially via the TAP. It is an external boundary-scan extension of the unit under test and can be used to test peripheral I/Os, connectors, backplanes, bases, etc.

Multiple modules of the same or different specifications can be easily cascaded to increase the number of channels. Currently, we offer four different versions of the CION module.

The CION modules are based on the CION™ interface chip, also developed by GOEPEL Electronics, and can be accessed and controlled serially via the TAP. It is an external boundary-scan extension of the unit under test and can be used to test peripheral I/Os, connectors, backplanes, bases etc.

Multiple modules of the same or different specifications can be easily cascaded to increase the number of channels. Currently, we offer four different versions of the CION module.

The CION modules are based on the CION™ interface chip, also developed by GOEPEL Electronics, and can be accessed and controlled serially via the TAP. It is an external boundary-scan extension of the unit under test and can be used to test peripheral I/Os, connectors, backplanes, bases etc.

Multiple modules of the same or different specifications can be easily cascaded to increase the number of channels. Currently, we offer four different versions of the CION module.